Do different generations of DDR chips look different?
Catégorie : Specification / Capacity / Performance
Most DDR modules adopt TSOP package with pins sticking out from Flash sides. Some DDR chips go with a less common FBGA package which is physically smaller, and uses a grid of tiny solder balls on bottom to make electrical contact with the board. At present, the FBGA package is the standard for all DDR2, DDR3 and DDR4 chips.
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